History
2024
B+ Round of Financing & In-depth Development
- Won the title of“national specialized,unique and new small giant enterprise”&“Chinese (potential) unicorn enterprise”&“2024 Hurun Global Cheetah Enterprise”
- Successfully launched 8” silicon carbide substrate grinding and polishing full-line equipment and 8” silicon carbide wafer grinder
- Established the Langfang Branch
- Completed B+ round of financing
2023
Series B Financing & Establishment of branch office
- Won the Beijing special new small and medium-sized enterprise, Beijing intellectual property pilot unit,
- Post-doctoral research workstation identification
- Successfully released TFG series automatic grinder, TPC series automatic chemical mechanical polisher,
- TSC series wafer scrubber and TGP series diamond polisher
- Set up branchs in Wuxi, Shenzhen
- Completed Series B financing
2022
Strategic financing & moving the Company to a new location
- Strategic investment reached with Shenzhen Hubble and the first round of investment with Anxin and Hongtai
- Successfully launched TDL and TDP series double-sided grinding and polishing equipment
- Able to provide silicon carbide substrate grinding and polishing line equipment
- Established the Langtour Laboratory and Excelsior Laboratory
- Moved the Company to Scientific Entrepreneurship Chip Park No.1
2021
Increase R&D investment & develop the business rapidly
- Awarded as a national high-tech enterprise
- Successfully launched TAP series single-sided polishing equipment to enrich the product line
- Able to meet diversified market demands
2020
Accelerate equipment R&D & expand the business comprehensively
- Established the TSD Semiconductor Company with a focus on the semiconductor industry
- Successfully launched TSP series single-sided polishing machine
- IVG series grinder
2014-2020
Accumulate technology & build a product system
- Independent research and development have been built up over 6 years，Established the three major product systems of thinning, polishing, and CMP
