Chemical Mechanical Polishing for Glass Substrate
TPP-1310
An operator manually places the carrier plate onto the loading/unloading workstation. The workstation then transfers the plate onto the upper polishing platen for automated polishing. The machine is equipped with friction-based endpoint detection, which automatically stops the process once the target value is reached.
Wafer Size515*510mm / 600*600mm
Number of Polishing Heads1
Polishing head diameterOD930 mm
Diameter of polishing discOD1300 mm
