Diamond substrate Polisher
                    TGP-1040/1540 series
                    
                    This polishing machine is developed specially for diamond materials with single spindle and multiple stations. The polishing disc is characterized by high speed and swinging operations. The diamond substrate is fixed by vacuum adsorption and clamping. They can meet the requirements for high speed polishing of diamond materials.
                 
                                
                                
                                                            
                                                Polishing plate SpecificationsOD400 mm
                                                Amout of Polishing head4
                                                Size of Polishing head2/4 inch
                                                RPM Range of Polishing plate0-1500 RPM