Solid Wax Bonder
                    TWB-1150S
                    
                    This is a high-precision semi-automatic solid wax chip mounter with manual chip placement, automatic wax dripping, automatic chip picking alignment & placement, and automatic air bag pressurization. It also has slide heating, hot pressing and cooling functions, resulting in uniform wax layers and outstanding wax-pasting effects.
                 
                                
                                
                                                            
                                                Wafer Size2/4 inch
                                                Maximum Ceramic Plate SizeOD150 mm
                                                Mode Of OperationSemi-automatic
                                                Wax CoatingSolid wax in a wax can for dripping