Wafer Scrubber
                    TSC-150C/200C/200L
                    
                    This series comprises special cleaning machines for wafers after polishing. They integrate automatic loading and unloading systems, double-sided PVA scrubbing, mega-sonic cleaning, spin drying & N2 blow drying, and other units. They also enable wet/dry-in and dry-out functions, and are suitable for cleaning various semiconductor wafers after polishing.
                 
                                
                                
                                                            
                                                Cleaning StationBelt transfer type 6 station
                                                Wafer Size3-6 inch
                                                Scrub Station *22 PVA brushes, double-sided cleaning