Wafer Scrubber
                    TSC-100/300S
                    
                    This series comprises special cleaning equipment for wafers after CMP, with a single-station single-chamber design. These machines can integrate PVA scrubbing, mega-sonic cleaning, N2 blow drying, high-speed spin drying, and other functions with a high degree of integration, and are suitable for cleaning various semiconductor wafers after CMP.
                 
                                
                                
                                                            
                                                ProcessSingle-sided cleaning
                                                Cleaning StationSingle-lumen single station
                                                Upper And Lower PieceManual
                                                Wafer Size2-6 inch