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Grinder
Single-Side Polisher
Double-Side Polisher
Wax Bonder
Wafer Scrubber
Fully-Automatic Grinder/Polisher
TGP-3350
This equipment is suitable for thinning and polishing of 8-12-inch wafers, fully adopting air-float spindles and air-float turntable design. It is equipped with automatic thickness measurement, integrated wafer calibration and other functions, realizing fully automatic loading/unloading and dry-in dry-out operation
  • Maximum Wafer Size

    12 inch

  • Grinding spindle power

    7.5 kw

  • Grinding spindle grinding wheel size

    OD303 mm

  • Polishing head size

    OD450 mm

    • Features
    fully-automatic-grinderpolisher
    Integrated Robotic Wafer Loading/Unloading，Dry-in/Dry-out Process
    Comprehensive functions
    Automatic Thickness Measurement, Integrated Wafer Alignment, Cleaning, and Spin-drying Functions
    Good compatibility
    Suitable for thinning and polishing of 8-12 inch silicon wafers
    Abundant configurations
    All adopt air-float spindle and air-float turntable design
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