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Grinder
Single-Side Polisher
Double-Side Polisher
Wax Bonder
Wafer Scrubber
EMC Strip Fully-Automatic Grinder
TSG-200A
This equipment is a dual-spindle, dual-worktable machine that processes resin materials through diamond grinding wheels using creep-feed grinding. It is equipped with functions such as automatic thickness measurement, multi-stage grinding, and overload waiting, and features fully automatic loading/unloading and dry-in dry-out operation
  • Workpiece Size

    Max 300×100，Min 100×50

  • Number of Grinding Wheel Axes

    2

  • Grinding Wheel Axis Power

    5 kw

  • Grinding Wheel Specifications

    OD180 mm

    • Features
    Automatic system
    Integrated Robotic Wafer Loading/Unloading，Dry-in/Dry-out Process
    Comprehensive functions
    Automatic measurement of thickness, multi-stage grinding process, and overload standby
    Pressurizing method
    Process resin materials by creep-feed grinding with diamond grinding wheels
    Abundant configurations
    Dual spindles, dual worktables, and support for 5 vacuum zones
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