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Semi-Automatic Single Spindle Grinder
IVG-2020/3020
This semi-automatic single spindle grinder is suitable for grinding 2”-12” wafers and materials to special specifications. In addition to manual loading, simple operations, and abundant functions, the machine is equipped with an automatic thickness measurement and compensation system to improve grinding accuracy. The operations surface can be customized according to customer requirements, achieving excellent results across a wide range of applications.
  • Maximum Wafer Size

    8 inch

  • Grinding Wheel Specification

    ?203(OD)mm

  • Grinding Wheel Spindle Power

    6.0 kw

  • Features
    Flexible operation
    Manual loading and unloading, wafer dry in wet out
    Comprehensive functions
    Automatic measurement of thickness, multi-stage grinding process, and overload standby
    Good compatibility
    Suitable for a variety of semiconductor materials, suitable for thinning 2”-12” wafer