Semi-Automatic Single Spindle Grinder
                    IVG-2020/3020
                    
                    This semi-automatic single spindle grinder is suitable for grinding 2”-12” wafers and materials to special specifications. In addition to manual loading, simple operations, and abundant functions, the machine is equipped with an automatic thickness measurement and compensation system to improve grinding accuracy. The operations surface can be customized according to customer requirements, achieving excellent results across a wide range of applications.
                 
                                
                                
                                                            
                                                Maximum Wafer Size8 inch
                                                Grinding Wheel Specification?203(OD)mm 
                                                Grinding Wheel Spindle Power6.0 kw