国产自产拍在线播放,精品国内免费一区二区,日本高清不卡一区二区三区,国产成人久久精品麻豆二区,三级做爰在线观看,99精品热在线观看视频,日本有遮挡边做边爱边摸,日韩欧美国产中文字幕

Grinder
Single-Side Polisher
Double-Side Polisher
Wax Bonder
Wafer Scrubber
Single-Side Polisher
TAP-400/450/500/600 series
This series of polishing machine comprises double-spindle high-precision single-sided polishing equipment. These machines can be equipped with corresponding polishing heads for different wafers, fix wafers by vacuum adsorption, and pressurize using air bags. The polishing head can rotate and swing. They are suitable for polishing various semiconductor materials.
  • Plate Specifications

    OD400 mm

  • Number of Polishing Heads

    2

  • Polishing Head Swing

    Adjustable Swing & Speed

    • Features
    Drive mode
    Polishing head rotates and swings at meantime
    Pressurizing method
    Vacuum adsorption fixed wafer airbag pressurization
    Constant temperature control
    Temperature control system for polishing plate
    Abundant configurations
    Double spindle processing, equipped with polishing plate conditioner
    Good compatibility
    Different type of polishing heads are available to match different type of wafer
    Pressure calibration
    Precision weighing sensor to monitor downward pressure
    Convenient processing
    The semi-automatic wafer loading and unloading system is optional
    Submitted successfully
    We will contact you as soon as possible.
    Submission failed
    Please refresh the page and resubmit.
    Follow Us
    • >